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CRR Series
SPST Reed Relays
DESCRIPTION
The MEDER CRR Reed Relay Series is a low-profile
device made with a ceramic case that exactly matches
the thermal coefficient of expansion of the Reed Switch
glass and the reed lead to eliminate any potential
packaging stress. This Reed Relay is the smallest in the
industry and switches into the billions of operations.
MEDER electronic
FEATURES
This Relay has 1 μ V typical thermal offset. Measuring
only 8.6 mm x 4.4 mm x 3.4 mm, the leadless design
eliminates skewing of leads and coplanarity issues.
Insulation resistance typical to all points is >10 14 Ohms.
APPLICATIONS
? Test and measurement
? Medical equipment
? Telecommunications
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Ceramic / thermoset molded package
Patent pending
Smallest in the industry
No lead frame surface mount design eliminates
skewing of leads and coplanarity issues
Available with BGA
Internal magnetic shield standard
Very low profile
Gold plated leads
Low thermal offset typical 1 μV
TCE matching of all internal components
Insulation resistance typical 1014 ohms
3 Volt option available
DIMENSIONS (Non-BGA)
*All dimensions in mm (inch)
1A
8.6 ±01
[0.339±0.004]
1B
4.4 ±01
[0.173±0.004]
PIN OUT
(Top View)
PCB LAYOUT
3.60
[0.1417]
1.20 ? 0.95
0.50
[0.0472] [ ? 0.0031]
[0.0197]
PAD LAYOUT
(Bottom View)
10
9
8
7
6
5
0.70
[0.0276]
10x R0.475
[0.187]
1.20
[0.0472]
1
2
+
3
4
0.95
[0.0374]
9.60
[0.378]
3.125
[0.123]
1A
1B
www.meder.com
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